Patent Assignment
Reel/Frame 058940/0979
Assignment of Assignor's Interest
Recorded: 2022-02-09
Pages: 10
Assignors
PRIEWASSER, KARL HEINZ
Executed: 2021-04-15
SAITO, TAKESHI
Executed: 2021-04-13
TSUKUI, TOMOYA
Executed: 2021-04-14
KANAI, TOMOYUKI
Executed: 2021-04-13
Assignees
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI, 2-CHOME, CHUO-KU, TOKYO, 1038338, JAPAN
DISCO CORPORATION
13-11 OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 1438580, JAPAN
Covered Property
(1)
Back Grinding Adhesive Sheet, and Method for Manufacturing Semiconductor Wafer