Patent Assignment
Reel/Frame 059054/0304
Assignment of Assignor's Interest
Recorded: 2022-02-20
Pages: 6
Assignors
YEOM, DONGHYUK
Executed: 2022-02-03
LEE, KWAN HEUM
Executed: 2022-02-03
PARK, SEONGHWA
Executed: 2022-02-03
LIM, SECHAN
Executed: 2022-02-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same