Patent Assignment
Reel/Frame 059131/0275
Assignment of Assignor's Interest
Recorded: 2022-03-01
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Debonding Tape and Method of Processing Semiconductor Wafer Using the Same