Patent Assignment
Reel/Frame 059204/0179
Assignment of Assignor's Interest
Recorded: 2022-03-09
Pages: 4
Assignors
ZHANG, YUN
Executed: 2021-01-25
ZHANG, XINGXING
Executed: 2021-01-25
WOHLFARTH, VOLKER
Executed: 2022-03-09
WANG, JING
Executed: 2021-01-25
DONG, PEIPEI
Executed: 2021-01-25
ZHAO, WEI
Executed: 2021-01-25
Assignees
SUZHOU SHINHAO MATERIALS LLC
2358 CHANGAN ROAD, WUJIANG, SUZHOU, JIANGSU, 215200, CHINA
UMICORE GALVANOTECHIK GMBH
KLARENBERGSTRASSE 53 - 79, SCHWAEBISCH GMUEND, 73525, GERMANY
Covered Property
(1)
Method of Electroplating Stress-Free Copper Film
Application:
17/166,104 →
Publication:
US 2022/0064813
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.