Patent Assignment
Reel/Frame 059233/0588
Assignment of Assignor's Interest
Recorded: 2022-03-11
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2022-03-10
LIN, MENG-LIANG
Executed: 2022-03-10
JENG, SHIN-PUU
Executed: 2022-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Structures to Increase Substrate Routing Density and Methods of Forming the Same