Patent Assignment
Reel/Frame 059260/0288
Assignment of Assignor's Interest
Recorded: 2022-03-14
Pages: 20
Assignors
MALLIK, DEBENDRA
Executed: 2021-12-15
KABIR, MOHAMMAD ENAMUL
Executed: 2021-12-14
DESHPANDE, NITIN
Executed: 2022-01-05
KARHADE, OMKAR
Executed: 2021-12-15
SARKAR, ARNAB
Executed: 2022-02-18
AGRAHARAM, SAIRAM
Executed: 2021-12-16
PELTO, CHRISTOPHER
Executed: 2021-12-14
KIM, GWANG-SOO
Executed: 2022-01-14
MAHAJAN, RAVINDRANATH
Executed: 2021-12-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly