Patent Assignment
Reel/Frame 059326/0108
Assignment of Assignor's Interest
Recorded: 2022-03-21
Pages: 5
Assignors
HUANG, TZU-SUNG
Executed: 2022-03-09
CHIANG, TSUNG-HSIEN
Executed: 2022-03-09
TSENG, MING HUNG
Executed: 2022-03-09
TSAI, HAO-YI
Executed: 2022-03-09
HU, YU-HSIANG
Executed: 2022-03-09
LIN, CHIH-WEI
Executed: 2022-03-09
CHUANG, LIPU KRIS
Executed: 2022-03-10
TSAI, WEI LUN
Executed: 2022-03-20
CHIANG, KAI-MING
Executed: 2022-03-20
LIN, CHING YAO
Executed: 2022-03-20
LI, CHAO-WEI
Executed: 2022-03-20
HSIEH, CHING-HUA
Executed: 2022-03-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Staggered Metal Mesh on Backside of Device Die and Method Forming Same