Patent Assignment
Reel/Frame 059391/0272
Assignment of Assignor's Interest
Recorded: 2022-03-24
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure Including Photonic Package and Interposer Having Waveguide