IP Library Assignment 059409/0946
Patent Assignment
Reel/Frame 059409/0946

Assignment of Assignor's Interest

Recorded: 2022-03-28 Pages: 3
Assignors
COOMBS, NICHOLAS
Executed: 2022-03-26
COPPOLA, JON
Executed: 2022-03-25
AGHAJANIAN, MIKE
Executed: 2022-03-25
CHRISS, AARON
Executed: 2022-03-28
Assignee
II-VI DELAWARE, INC.
1105 NORTH MARKET STREET, SUITE 1300, WILMINGTON, DELAWARE, 19801
Covered Property (1)
Laser-Roughened Reaction-Bonded Silicon Carbide for Wafer Contact Surface
Application: 17/656,481 →
Publication: US 2023/0321758
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →