Patent Assignment
Reel/Frame 059425/0359
Assignment of Assignor's Interest
Recorded: 2022-03-29
Pages: 6
Assignors
KOGA, SHUNSUKE
Executed: 2022-03-23
SASAKI, TOMOKI
Executed: 2022-03-23
TACHIBANA, YOSHIE
Executed: 2022-03-23
YOSHIKAWA, SHUNSAKU
Executed: 2022-03-23
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Preform Solder and Method of Manufacturing the Same, and Method of Manufacturing Solder Joint