Patent Assignment
Reel/Frame 059600/0159
Assignment of Assignor's Interest
Recorded: 2022-04-14
Pages: 4
Assignors
HIKOSAKA, SO
Executed: 2021-12-07
NOMACHI, AKIKO
Executed: 2021-12-07
MATSUURA, OSAMU
Executed: 2022-04-05
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
3D Semiconductor Memory Device Including Inter-Finger Structure and Interlayer Insulating Layers Configured to Absorb Compressing Stress