Patent Assignment
Reel/Frame 059697/0342
Assignment of Assignor's Interest
Recorded: 2022-04-25
Pages: 4
Assignor
OH, JOOYOUNG
Executed: 2022-03-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Adhesive Members