Patent Assignment
Reel/Frame 059816/0974
Assignment of Assignor's Interest
Recorded: 2022-05-04
Pages: 4
Assignors
CHEN, YING-HUA
Executed: 2022-04-21
LU, HAU-YAN
Executed: 2022-01-18
LU, WEN-CHEN
Executed: 2022-01-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Photonic Package Device and Method for Fabricating the Same
Patent:
11,698,489 →
Application:
17/674,957 →