Patent Assignment
Reel/Frame 059834/0838
Assignment of Assignor's Interest
Recorded: 2022-05-06
Pages: 2
Assignors
FETTKE, MATTHIAS
Executed: 2022-05-04
KOLBASOW, ANDREJ
Executed: 2022-05-04
LANGE, NICO
Executed: 2022-05-04
Assignee
PAC TECH - PACKAGING TECHNOLOGIES GMBH
AM SCHLANGENHORST 7-9, NAUEN, 14641, GERMANY
Covered Property
(1)
Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole