Patent Assignment
Reel/Frame 059902/0575
Assignment of Assignor's Interest
Recorded: 2022-05-13
Pages: 8
Assignors
CHO, EUNHYOUNG
Executed: 2022-05-09
LEE, SUNGHEE
Executed: 2022-05-09
LEE, JEONGYUB
Executed: 2022-05-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Filling Gap Using Atomic Layer Deposition
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.