Patent Assignment
Reel/Frame 059923/0119
Assignment of Assignor's Interest
Recorded: 2022-05-16
Pages: 7
Assignors
KIM, JONGWAN
Executed: 2022-04-26
LEE, YONGKWAN
Executed: 2022-04-26
KOH, KYONGHWAN
Executed: 2022-04-26
KIM, SEUNGHWAN
Executed: 2022-04-26
KIM, JUNGJOO
Executed: 2022-04-26
PARK, JUNWOO
Executed: 2022-04-26
JEON, TAEJUN
Executed: 2022-04-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Electromagnetic Shield Structure