IP Library › Assignment 059971/0393
Patent Assignment
Reel/Frame 059971/0393

Assignment of Assignor's Interest

Recorded: 2022-05-20 Pages: 3
Assignors
KUIPER, GUUS
Executed: 2020-12-18
WIMMENHOVE, TOM
Executed: 2020-12-17
INANÇ, BAHRI SINAN
Executed: 2020-12-15
Assignee
BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
INSTITUTENWEG 25A, ENSCHEDE, 7521 PH, NETHERLANDS
Covered Property (1)
Extrusion-Based Additive Manufacturing: Method, 3D Printing System, and 3D Printed Object
Application: 17/778,563 →
Publication: US 2023/0001644
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Sep 4, 2024
From: BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.
To: DEMCON NEWCO 9 B.V.
Reel/Frame 068486/0393 →
Change of Name Sep 4, 2024
From: DEMCON NEWCO 9 B.V
To: DEMCON BOND 3D B.V.
Reel/Frame 068843/0498 →