Patent Assignment
Reel/Frame 059996/0901
Assignment of Assignor's Interest
Recorded: 2022-05-24
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
High-Density 3D-Dram Cell with Scaled Capacitors