Patent Assignment
Reel/Frame 060001/0953
Assignment of Assignor's Interest
Recorded: 2022-05-24
Pages: 4
Assignors
HORI, MOTOHITO
Executed: 2022-04-19
IKEDA, YOSHINARI
Executed: 2022-04-21
HIRAO, AKIRA
Executed: 2022-04-21
Assignee
FUJI ELECTRIC CO., LTD.
1-1, TANABESHINDEN, KAWASAKI-KU, KAWASAKI-SHI, KANAGAWA, 210-9530, JAPAN
Covered Property
(1)
Semiconductor Device Including a Sealing Member to Seal a Semiconductor Chip, a Printed Circuit Board, and a Conductive Block