Patent Assignment
Reel/Frame 060010/0514
Assignment of Assignor's Interest
Recorded: 2022-05-25
Pages: 4
Assignor
LEE, CHIEN-CHENG
Executed: 2022-04-28
Assignee
BOARDTEK ELECTRONICS CORPORATION
16,CHING CHIEN 1ST RD,KUAN-YIN INDUSTRIAL PARKK,, TAOYUAN, TAIWAN
Covered Property
(1)
Packaging Structure with Embedded Power Chip and Circuit Board Module Having the Same