Assignment of Assignor's Interest

Recorded: 2022-06-02 Pages: 4

Assignors

NAGASAWA, RIKI

Executed: 2022-04-28

TAKASU, HIROAKI

Executed: 2022-05-18

KARIKOME, OSAMU

Executed: 2022-04-28

Assignee

ABLIC INC.

3-9-6 MITA, MINATO-KU, TOKYO, 108-8330, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device and Semiconductor Device

Application: 17/804,169 →

Publication: US 2023/0010077

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.