Patent Assignment
Reel/Frame 060107/0821
Assignment of Assignor's Interest
Recorded: 2022-06-06
Pages: 3
Assignor
TAKANO, EIJI
Executed: 2022-05-25
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device Including Resin Layers