Patent Assignment
Reel/Frame 060109/0037
Assignment of Assignor's Interest
Recorded: 2022-06-06
Pages: 4
Assignors
PAN, KUAN-TING
Executed: 2020-11-03
CHIANG, KUO-CHENG
Executed: 2020-11-03
CHANG, SHANG-WEN
Executed: 2020-11-03
TSAI, CHING-WEI
Executed: 2020-11-03
CHENG, KUAU-LUN
Executed: 2020-11-03
WANG, CHIH-HAO
Executed: 2020-11-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same