Patent Assignment
Reel/Frame 060197/0877
Assignment of Assignor's Interest
Recorded: 2022-06-14
Pages: 6
Assignors
KIM, DONGKYU
Executed: 2022-03-10
KIM, MINJUNG
Executed: 2002-03-10
SUK, KYOUNG LIM
Executed: 2022-03-10
LEE, SEOKHYUN
Executed: 2022-03-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Redistribution Substrate