Patent Assignment
Reel/Frame 060350/0752
Assignment of Assignor's Interest
Recorded: 2022-06-29
Pages: 4
Assignors
CHEN, HSIA-WEI
Executed: 2022-06-20
CHANG, CHIH-HSIANG
Executed: 2022-06-28
LIAO, YU-WEN
Executed: 2022-06-21
CHU, WEN-TING
Executed: 2022-06-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Method of Forming a Resistive Memory Device with Ultra-Thin Barrier Layer