Patent Assignment
Reel/Frame 060353/0989
Assignment of Assignor's Interest
Recorded: 2022-06-29
Pages: 6
Assignors
PAVLICEK, NIKO
Executed: 2022-06-17
SANTOLARIA, LLUIS
Executed: 2022-06-21
TRUESSEL, DOMINIK
Executed: 2022-06-21
MATA, HELDER
Executed: 2022-06-24
Assignee
HITACHI ENERGY SWITZERLAND AG
BRUGGERSTRASSE 72, BADEN, 5400, SWITZERLAND
Covered Property
(1)
Power Semiconductor Module with Injection-Molded or Laminated Cooler Assembly
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.