Patent Assignment
Reel/Frame 060375/0063
Assignment of Assignor's Interest
Recorded: 2022-06-30
Pages: 9
Assignors
DAS SHARMA, DEBENDRA
Executed: 2022-06-28
CHOUDHARY, SWADESH
Executed: 2022-06-02
LANKA, NARASIMHA
Executed: 2022-06-03
SESHAN, LAKSHMIPRIYA
Executed: 2022-06-06
PASDAST, GERALD
Executed: 2022-06-02
WU, ZUOGUO
Executed: 2022-06-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die-To-Die Interconnect Protocol Layer
Application:
17/853,502 →
Publication:
US 2022/0327084