Patent Assignment
Reel/Frame 060394/0631
Assignment of Assignor's Interest
Recorded: 2022-07-04
Pages: 3
Assignors
LIN, TZU-HUNG
Executed: 2018-02-05
CHANG, CHIA-CHENG
Executed: 2018-02-05
PENG, I-HSUAN
Executed: 2018-02-05
LIU, NAI-WEI
Executed: 2018-02-05
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure