Patent Assignment
Reel/Frame 060448/0160
Change of Name
Recorded: 2022-06-28
Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
1-9-2, MARUNOUCHI, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 14, 2020
From: YOSHIDA, YUKA; MARUYAMA, NAOKI; HIGASHIUCHI, TOMOKO; FUKUDA, KAZUMASA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052663/0945 →
Change of Name
Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment.
Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →