Assignment of Assignor's Interest

Recorded: 2022-07-12 Pages: 6

Assignors

LEE, JANGGEUN

Executed: 2022-06-15

CHOI, JAEMYUNG

Executed: 2022-06-29

SEO, KANG-ILL

Executed: 2022-06-29

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU,, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Device Including Spacer via Structure and Method of Manufacturing the Same

Application: 17/841,245 →

Publication: US 2023/0343697

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.