Patent Assignment
Reel/Frame 060531/0583
Assignment of Assignor's Interest
Recorded: 2022-07-18
Pages: 4
Assignors
CHEN, MING-SZE
Executed: 2022-07-18
WANG, HUNG-CHIH
Executed: 2022-07-16
CHI, YUAN-HSIN
Executed: 2022-07-18
LIN, SHENG-YUAN
Executed: 2022-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6,, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Connect Structure for Semiconductor Processing Equipment