Patent Assignment
Reel/Frame 060546/0957
Assignment of Assignor's Interest
Recorded: 2022-07-19
Pages: 6
Assignors
ALEKSOV, ALEKSANDAR
Executed: 2016-12-19
DOGIAMIS, GEORGIOS C.
Executed: 2016-12-19
KAMGAING, TELESPHOR
Executed: 2016-12-19
OSTER, SASHA N.
Executed: 2016-12-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronic Devices Designed with 3D Stacked Ultra Thin Package Modules for High Frequency Communications