Patent Assignment
Reel/Frame 060708/0421
Assignment of Assignor's Interest
Recorded: 2022-08-03
Pages: 4
Assignors
MATSUBARA, HIROSHI
Executed: 2022-08-01
HARADA, MASATOMI
Executed: 2022-07-15
KAGAWA, TAKESHI
Executed: 2022-07-15
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Semiconductor Device and Module