Patent Assignment
Reel/Frame 060730/0471
Release of Patent Collateral
Recorded: 2022-07-19
Pages: 4
Assignor
BANK OF AMERICA, N.A.
Executed: 2022-01-03
Assignee
ANDROID INDUSTRIES, L.L.C.
2155 EXECUTIVE HILLS DR., AUBURN HILLS, MICHIGAN, 48326
Covered Properties
(2)
Tire Preparation for Adhesive Using Laser Ablation System and Method
Tire Sensor Installation System and Method
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 14, 2019
From: STRAITIFF, DONALD GRAHAM; CLARK, BARRY ALLAN; LAWSON, LAWRENCE J.; MASSERANG, KEITH
To: ANDROID INDUSTRIES LLC
Reel/Frame 048332/0352 →
Patent and License Security Agreement
Aug 27, 2021
From: ANDROID INDUSTRIES, L.L.C.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 057650/0577 →
Security Interest
Dec 12, 2025
From: ANDROID INDUSTRIES, L.L.C.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 073934/0117 →
Security Interest
Dec 15, 2025
From: ANDROID INDUSTRIES, L.L.C.
To: ANSLEY PARK CAPITAL LLC, AS COLLATERAL AGENT
Reel/Frame 073948/0028 →
Release of Security Interest
Dec 17, 2025
From: BANK OF AMERICA, N.A.
To: ANDROID INDUSTRIES, L.L.C.
Reel/Frame 074006/0866 →