Patent Assignment
Reel/Frame 060771/0918
Assignment of Assignor's Interest
Recorded: 2022-08-10
Pages: 4
Assignors
HUANG, WANG-CHUN
Executed: 2021-03-10
CHEN, HOU-YU
Executed: 2021-03-10
CHENG, KUAN-LUN
Executed: 2021-03-10
WANG, CHIH-HAO
Executed: 2021-03-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device