Patent Assignment
Reel/Frame 060910/0122
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 4
Assignors
LIAO, YI-HUAN
Executed: 2022-08-25
HSIEH, PING-YIN
Executed: 2022-08-25
CHEN, CHIH-HAO
Executed: 2022-08-24
WANG, PU
Executed: 2022-08-24
CHENG, LI-HUI
Executed: 2022-08-24
SHIH, YING-CHING
Executed: 2022-08-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method