Patent Assignment
Reel/Frame 060914/0542
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 7
Assignors
LEE, WONIL
Executed: 2022-05-25
KIM, MINKI
Executed: 2022-05-25
KIM, JIHOON
Executed: 2022-05-25
JEON, GWANGJAE
Executed: 2022-05-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package, and Method of Manufacturing the Same