Patent Assignment
Reel/Frame 061070/0275
Assignment of Assignor's Interest
Recorded: 2022-09-13
Pages: 8
Assignors
XU, HUAHUA
Executed: 2022-07-25
GONG, XINHU
Executed: 2021-12-25
TANG, YINZHONG
Executed: 2022-08-02
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA
Covered Property
(1)
Circuit Board Assembly, Backplane Interconnection System, and Electronic Device