Assignment of Assignor's Interest

Recorded: 2022-09-22 Pages: 3

Assignors

ZHAI, JUN

Executed: 2022-09-15

DABRAL, SANJAY

Executed: 2022-09-19

HU, KUNZHONG

Executed: 2022-09-12

LU, JIONGXIN

Executed: 2022-09-15

Assignee

APPLE INC.

ONE APPLE PARK WAY, CUPERTINO, CALIFORNIA, 95014

Covered Property (1)

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

Application: 17/934,346 →

Publication: US 2024/0105545