Patent Assignment
Reel/Frame 061186/0746
Assignment of Assignor's Interest
Recorded: 2022-09-22
Pages: 2
Assignee
APPLE INC.
ONE APPLE PARK WAY, CUPERTINO, CALIFORNIA, 95014
Covered Property
(1)
3D System and Wafer Reconstitution with Mid-layer Interposer
Application:
17/934,409 →
Publication:
US 2024/0105699