Patent Assignment
Reel/Frame 061209/0620
Assignment of Assignor's Interest
Recorded: 2022-09-26
Pages: 4
Assignors
CHENG, KAI-FANG
Executed: 2022-07-31
TSAI, CHERNG-SHIAW
Executed: 2022-07-27
LEE, CHENG-CHIN
Executed: 2022-07-27
WU, YEN-JU
Executed: 2022-09-12
CHANG, HSIAO-KANG
Executed: 2022-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnection Structure and Method for Fabricating the Same
Application:
17/877,387 →
Publication:
US 2024/0038665