Patent Assignment
Reel/Frame 061259/0178
Assignment of Assignor's Interest
Recorded: 2022-09-29
Pages: 12
Assignors
ECTON, JEREMY
Executed: 2022-09-21
MARIN, BRANDON
Executed: 2022-09-20
PIETAMBARAM, SRINIVAS
Executed: 2022-09-16
DUAN, GANG
Executed: 2022-09-19
NAD, SUDDHASATTWA
Executed: 2022-09-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multichip Ic Devices with Die Embedded in Glass Substrate & a Redistribution Layer Interconnect Bridge
Application:
17/956,363 →
Publication:
US 2024/0113075