Patent Assignment
Reel/Frame 061262/0563
Assignment of Assignor's Interest
Recorded: 2022-08-19
Pages: 13
Assignors
ELSHERBINI, ADEL A.
Executed: 2022-07-22
SIERS, SCOTT E.
Executed: 2022-07-25
PASDAST, GERALD S.
Executed: 2022-07-22
SWAN, JOHANNA M.
Executed: 2022-07-26
BRAUNISCH, HENNING
Executed: 2022-07-26
JUN, KIMIN
Executed: 2022-07-28
SEANGATITH, JIRAPORN
Executed: 2022-07-22
LIFF, SHAWNA M.
Executed: 2022-07-24
ENAMUL KABIR, MOHAMMAD
Executed: 2022-07-22
TIAGARAJ, SATHYA NARASIMMAN
Executed: 2022-07-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Architecture of Large Dies Using Quasi-Monolithic Chip Layers