Patent Assignment
Reel/Frame 061264/0950
Assignment of Assignor's Interest
Recorded: 2022-08-19
Pages: 6
Assignors
CHANG, CHUN-WEI
Executed: 2022-06-30
LIN, JIAN-HONG
Executed: 2022-06-30
KU, SHU-YUAN
Executed: 2022-06-30
LIU, WEI-CHENG
Executed: 2022-07-27
LU, YINLUNG
Executed: 2022-07-10
HE, JUN
Executed: 2022-06-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Package Component and Forming Method Thereof