Patent Assignment
Reel/Frame 061306/0497
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 9
Assignors
ECTON, JEREMY
Executed: 2022-10-01
ALEKSOV, ALEKSANDAR
Executed: 2022-09-27
TANAKA, HIROKI
Executed: 2022-09-29
MARIN, BRANDON
Executed: 2022-09-27
PIETAMBARAM, SRINIVAS
Executed: 2022-09-27
BRUN, XAVIER
Executed: 2022-09-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Hybrid Bonding Technologies with Thermal Expansion Compensation Structures