Patent Assignment
Reel/Frame 061369/0746
CORRECTIVE ASSIGNMENT TO CORRECT THE 1ST INVENTOR'S EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 054030 FRAME: 0432. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
Recorded: 2022-09-01
Received: 2022-09-01
Pages: 11
Assignors
CHOI, SUNG HO
Executed: 2020-09-25
KIM, BYEONGHOON
Executed: 2020-09-25
LIM, SUNG JAE
Executed: 2020-09-25
SHIN, JONG HO
Executed: 2020-09-25
SON, DONG WON
Executed: 2020-09-25
CHO, SUNGWON
Executed: 2020-10-06
PARK, KYOUNGHEE
Executed: 2020-10-07
KIM, CHANGOH
Executed: 2020-10-08
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, 768442, SINGAPORE
Covered Application
(1)
EMI Shielding for Flip Chip Package with Exposed Die Backside
App. No. 17/068,482
→