Patent Assignment
Reel/Frame 061493/0376
Assignment of Assignor's Interest
Recorded: 2022-10-21
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Metal Particle for Adhesive Paste, Method of Preparing the Same, Solder Paste Including the Same, Composite Bonding Structure Formed Therefrom, and Semiconductor Device Including the Composite Bonding Structure