Patent Assignment
Reel/Frame 061602/0753
Assignment of Assignor's Interest
Recorded: 2022-10-31
Pages: 5
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Manufacturing Apparatus and Manufacturing Method of Semiconductor Device