Patent Assignment
Reel/Frame 061626/0694
Assignment of Assignor's Interest
Recorded: 2022-11-02
Pages: 7
Assignors
SUH, MINKYU
Executed: 2022-09-26
KIM, YANGDOO
Executed: 2022-09-26
KIM, YONGHWAN
Executed: 2022-09-26
PARK, SANGWUK
Executed: 2022-09-26
LEE, GEONYEOP
Executed: 2022-09-26
LEE, DOKEUN
Executed: 2022-09-26
HONG, JUNGPYO
Executed: 2022-09-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Integrated Circuit Device