Assignment of Assignor's Interest

Recorded: 2022-11-03 Pages: 5

Assignors

HOU, RUOYU

Executed: 2022-07-15

LU, JUNCHENG

Executed: 2022-07-19

DICKSON, ANDREW

Executed: 2022-07-19

Assignee

GAN SYSTEMS INC.

1145 INNOVATION DR., OTTAWA, K2K 3G8, CANADA

Covered Property (1)

Substrates for Power Stage Assemblies Comprising Bottom-Cooled Semiconductor Power Switching Devices

Application: 17/979,970 →

Publication: US 2023/0282540

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.